Robnor ResinLab EL171LF

EL171LF

Robnor ResinLab EL171LF is a low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and
electronic devices.

    • Low viscosity
    • Room temperature curing
    • Flame retardant to UL94 V-0
    • Adhesion to a wide variety of substrates


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Description

Robnor ResinLab EL171LF is a low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and electronic devices.

Additional information

Colour:

Mixed Viscosity (mPas):

Shore Hardness:

Specific Gravity:

Dielectric Strength (kV/mm):

Thermal Expansion (ppm/°C):

Gel Time - 150g mass (minutes):

Initial Cure (hours @ RT):

Flame Retardant:

Thermal Conductivity (W/mk):

UV Stability

Temperature Range (°C):

Tg(°C):

RoHS WEEE Reach