Showing all 12 results
-
Robnor EL110H PU Resin
Description
Robnor ResinLab EL110H is a two-part flexible polyurethane that offers excellent water resistance and electrical insulation characteristics.
Read more -
Robnor EL171LF PU Encapsulant
Description
Robnor ResinLab EL171LF is a low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and electronic devices.
Read more -
Robnor EL217C PU Resin
Description
Robnor ResinLab EL217C is a two-part, room temperature curing polyurethane system.
Read more -
Robnor EL225D PU Resin
Description
Robnor ResinLab EL225D is a low viscosity, semi-rigid polyurethane resin system exhibiting high electrical strength, toughness and adhesion.
Read more -
Robnor EL241F PU Resin
Description
Robnor ResinLab EL241F is a low viscosity, semi-rigid polyurethane resin system exhibiting high electrical strength, toughness, and adhesion.
Read more -
Robnor EL266D Polyurethane Encapsulant
Description
Robnor ResinLab EL266D is a two-part system designed for in-shore and offshore cable jointing and encapsulation.
Read more -
Robnor EL629DM PU Resin
Description
Robnor ResinLab EL629DM is a high performance, medium curing polyurethane resin system.
Read more -
Robnor PX439NL-1 Potting Compound
Description
Robnor ResinLab PX439NL-1 is a low viscosity, thermally conductive, flame retardant potting and encapsulating compound.
Read more -
Robnor PX628HV-2 Epoxy Adhesive
Description
Robnor ResinLab PX628HV-2 is high strength, two part, room temperature curing adhesive with dimensional stability.
Read more -
Robnor PX700K-1 Epoxy Encapsulant
Description
Robnor ResinLab PX700K-1 is a general purpose flame retardant potting and encapsulating compound.
Read more -
Robnor PX774D-1 Epoxy Adhesive
Description
Robnor ResinLab PX774D-1 is a high performance, rubber modified epoxy adhesive.
Read more -
Robnor PX804C Epoxy Encapsulant
Description
Robnor ResinLab PX804C is a non-toxic general purpose flame retardant potting and encapsulating compound.
Read more