Robnor EL171LF PU Encapsulant

Robnor ResinLab EL171LF is a low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and
electronic devices.

    • Low viscosity
    • Room temperature curing
    • Flame retardant to UL94 V-0
    • Adhesion to a wide variety of substrates


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